A comparative study of nanovoid growth in FCC metals
M. Ponga, M. Ortiz and M. P. Ariza
Philosophical Magazine, 97, 2985-3007 (2017).

ABSTRACT
Previous HotQC studies of Cu nanovoids undergoing volumetric expansion conducted
by the authors have uncovered a quasistatic-to-dynamic transition at a critical
strain rate of the order of 10(8) s(-1). At low strain rates nanovoid expansion
takes place under essentially isothermal conditions, whereas at high strain
rates it happens under essential adiabatic conditions. In this paper, we present
a comparative study concerned with two different scenarios, each representing a
variation on the reference case presented in [1]: (i) aluminium (Al) nanovoids
undergoing volumetric expansion; and (ii) copper (Cu) nanovoids undergoing
uniaxial deformation. Scenario (i) addresses material specificity by replacing
Cu by Al in the reference case, whereas scenario (ii) addresses the effect of
triaxiality by replacing volumetric expansion by uniaxial expansion in the
reference case. We find a distinct quasistatic-to-dynamic transition in both
scenarios, which suggests that the transition is indeed universal, i.e. material
and strain-triaxiality independent. By contrast, the fine structure of the
dislocation mechanisms that mediate void growth are strongly material and
loading specific.