Multiscale Assessment of Nanoscale Manufacturing Process on the Freeform Copper Surface
Y. Xu, H. Liu, L. Zhang and M. Becton
Materials, 13, 3135 (2020).


The nanocutting has been paid great attention in ultra-precision machining and high sealing mechanical devices due to its nanometer level machining accuracy and surface quality. However, the conventional methods applicable to reproduce the cutting process numerically such as finite element (FE) and molecular dynamics (MD) are challenging to unveil the cutting machining mechanism of the nanocutting due to the limitation of the simulation scale and computational cost. Here a modified quasi-continuous method (QC) is employed to analyze the dynamic nanocutting behavior (below 10 nm) of the copper sample. After preliminary validation of the effectiveness via the wave propagation on the copper ribbon, we have assessed the effects of cutting tool parameters and back-engagement on the cutting force, stress distribution and surface metamorphic layer depth during the nanocutting process of the copper sample. The cutting force and depth of the surface metamorphic layer is susceptible to the back-engagement, and well tolerant to the cutting tool parameters such as the tool rank angle and tool rounded edge diameter. The results obtained by the QC method are comparable to those from the MD method, which indicate the effectiveness and applicability of the modified QC method in the nanocutting process. Overall, our work provides an applicable and efficient strategy to investigate the nanocutting machining mechanism of the large-scale workpiece and shed light on its applications in the super-precision and high surface quality devices.